Toshi Oyama

The conference covers brazing and soldering research, development, and applications through plenary lectures, demonstrations, exhibits, and multiple tracks of presentations. Topics include aerospace, automotive and structural applications; corrosion of brazed joints; materials and process design and control; solder joining methods; filler-metal properties; mining and heavy equipment; furnace brazing; emerging technologies; joining ceramics, composites, lightweight materials, and refractory metals; and testing and inspection of brazed and soldered joints. The published program includes sessions on brazing ceramics, high-entropy and active filler metals, gas-turbine engines, stainless steels, cemented carbides, filler-metal and solder properties, brazing fluxes and chemical interactions, heat exchangers, properties of brazed and soldered joints, and processes and materials. C3 Committee meetings are also scheduled.