McKinsey & Company

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

A3 Members Only executive forum focused on the economic and market forces shaping the automation industry, business performance, emerging technologies, leadership priorities, innovation, and business growth. The substantive program includes Welcome & Opening Remarks, Economic, Business & Automation Outlook, and Closing Sessions. Featured voices include Connor Lokar of ITR Economics, Dr. James Hewitt, and Josh Linkner. The forum brings together leaders in robotics, machine vision, motion control, artificial intelligence, and industrial automation.

The conference theme is “Generating Combat Power Across Multiple Global Maritime Fronts.” Topics include evolving threats facing the Navy, Marine Corps, and Coast Guard; maritime operations; platforms, technologies, and advanced capabilities; and enhancing operational capabilities. The event brings together military and government leaders, industry professionals, and experts from academia for discussions, keynotes, panels, and special presentations. The 2027 agenda and speaker lineup were not available on the event pages reviewed.

The conference examines market and technology trends in bulk, rare, and specialty gases used in electronics, for executives, buyers, product managers, and strategic planners across the electronic-gases value chain. Sessions address U.S. semiconductor public policy, CHIPS metrology, gas-system challenges as Moore’s Law advances, vapor-phase materials, large-grain molybdenum deposition, solid precursor delivery, and tungsten powder supply-chain issues. A low-GWP adoption session discusses fab direct emissions, coordinated gas substitution, and industry-wide collaboration. Other technical topics include contamination control and yield, hydrogen-halide contamination, deuterium supply and purity, isotropic dry-cleaning technology, zero-nuclear-spin isotopes for semiconductor fabs and quantum computing, and new etch gases. The program also covers gas-delivery sealing, contamination and reliability tradeoffs; AI applications in automated gas handling; EUV tool gas purification; High NA EUV lithography infrastructure; sub-fab roadmaps and collaboration; precursor delivery and control; abatement; and emissions monitoring. Metrology sessions address MoCl5 stability and impurity measurements in electronic-grade rare gases and ultra-high-purity gases. Market sessions examine the global economy and semiconductors, fab capacity and equipment, helium, and specialty gases.