Northeastern University

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

The conference brings together policymakers, experts, and corporate leaders across the clean energy value chain. Topics include wind, solar, storage, transmission, and dealmaking.

The symposium covers power electronics in aerospace and naval systems, grid applications, industrial automation, renewable energy integration, power semiconductor devices, hardware-in-the-loop systems, electric drives, and simulations. The event also includes industry tutorials, industry demonstrations, and technical panels. Its focus spans power electronics technology and innovation from materials to systems, bringing together industry, academic, and government participants. Co-sponsored by UConn CONPEX and the IEEE PELS/PES Joint Student Chapter.