2027 IEEE International Solid-State Circuits Conference (ISSCC)

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

The published 2027 track framework covers electronic design across chip, board, package, and system levels. Topics include signal and power integrity for die, chiplets, interposers, and packaging; chip I/O and power modeling; photonics and wireless integration; PCB, module, and package materials and processing; and memory/HBM, chiplet, multi-die, and 3DIC/SiP interfaces. Other tracks address system co-design and modeling; high-speed links; jitter, noise, and error-ratio measurement and simulation; signal processing, modulation, equalization, and forward error correction; power delivery; EMC/EMI; test and measurement; and interconnect modeling and optimization. The machine-learning and AI track includes electronics design automation, behavioral models, system analytics, and performance optimization. Advanced automotive electronics topics include EV and autonomous systems, sensing, in-vehicle communications, charging, battery technology, and automotive testing. The conference format includes technical sessions, panels, tutorials, and boot camps.

SPCC combines technical sessions, poster presentations, and business-focused programming on surface preparation, cleaning technologies, and wet processes for semiconductor manufacturing. Technical topics include front-end, back-end, and packaging; cleaning equipment, materials, and metrology; advanced-memory challenges such as pattern collapse, contaminant removal from high-aspect-ratio structures, selective etching, and surface preparation for DRAM, 3D-NAND, and emerging memories; and wet and dry cleaning for FinFET, gate-all-around, nanosheet, nanowire, and CFET devices. Other areas include post-etch and post-CMP cleaning, advanced interconnect and EUV mask cleaning, contamination control, high-purity water and chemical delivery, in-situ monitoring, process control and AI/machine learning, trace-particle and metal detection, and sustainability. The scope also includes surface preparation for Ge, III-V, GaN, SiC, and 2D systems, as well as photovoltaics, MEMS, and nanoelectronics. Business-focused programming addresses macroeconomic, market, and structural trends shaping the global semiconductor industry, including industry dynamics, supply chain, and strategic outlook.

Four plenary sessions and technical panels address solid-state transformer (SST) topologies and system architectures; power devices, including SiC, GaN, high-voltage IGBTs, and medium-voltage protection; high-frequency magnetics, packaging, and thermal management; fusion as a potential power source for data centers; SST control, protection, reliability, cybersecurity, and grid services; and grid-interactive data centers, energy storage, onsite generation, and flexible AI loads. The program also includes poster sessions and awards. Panel topics include grid interconnection, microgrids, demand response, renewable integration, battery and long-duration storage, workload flexibility, waste-heat recovery, and coordination between data centers and utilities. Plenary speakers include Dr. Patrick Chapman, Vice President of Enphase Energy and a National Academy of Engineering member, and Dr. Le Xie, Gordon McKay Professor at Harvard University.

An international technical conference on solutions for improving semiconductor manufacturing. Technical presentations highlight industry innovations with specific results, and papers presented at the conference are peer-reviewed by the ASMC Technical Committee; select manuscripts are published in the IEEE Transactions on Semiconductor Manufacturing special section. The 2027 call for abstracts covers Advanced Equipment Processes and Materials; Advanced Metrology; Advanced Process Control; Defect Free Manufacturing; Defect Inspection and Reduction; Big Data Management and Cybersecurity; Equipment Optimization; Manufacturing for Sustainability; Novel Device Technologies; Patterning, Design & Technology Optimization; and Smart Manufacturing & Factory Operations.

The technical program combines peer-reviewed lecture and poster presentations, industry presentations, professional education seminars, plenary programming, and expert debates. Seminar themes include wide-bandgap device reliability, AI in power electronics, magnetics, converter topologies, electromagnetic compatibility and motor drives, and data-center power delivery. Specific topics include SiC and GaN switching behavior, online condition monitoring, AI-assisted converter design, planar magnetics, solid-state transformers, electric drives and e-mobility, and power delivery for AI accelerators and data centers. Technical and industry programming addresses modeling and simulation, data-center power systems, inverter design, chargers, power devices, test and characterization, and integrated voltage regulators. Debate topics include integrated voltage regulator roadmaps and roadblocks, whether solid-state transformers are ready for deployment, and whether future power-electronics breakthroughs will come from academia or industry. APEC is sponsored by the Power Sources Manufacturers Association, IEEE Power Electronics Society, and IEEE Industry Applications Society.

The program brings together the RF Integrated Circuits (RFIC), RF Systems & Applications (RFSA), and RF Technology & Techniques (RFTT) symposia, followed by the ARFTG Microwave Measurement Conference. The week also includes technical sessions, workshops, panels, plenary sessions, interactive forums, an exhibition, an Executive Forum, and a co-located IEEE Hard Tech Venture Summit. RFIC covers RF through THz integrated circuits and systems, including power amplifiers, front-end modules, oscillators, high-speed interconnects, advanced packaging, and applications such as wireless, radar, satellite communications, sensing, quantum systems, and AI-assisted design. RFSA addresses system-level research and applications including communications, radar, biomedical systems, phased arrays, non-terrestrial communications, and integrated sensing and communications. RFTT covers passive components, filters, packaging and 3D manufacturing, semiconductor technologies, circuit and system CAD, computational electromagnetics, quantum circuits, and sub-THz/THz circuits.

IEDM's future dates list this edition at Hilton Union Square San Francisco. The conference covers technological breakthroughs in semiconductor and electronic device technology, design, manufacturing, physics, and modeling. Its scope includes nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, process technology, device modeling and simulation, silicon, compound and organic semiconductors, and emerging material systems.