ASMC 2027—Advanced Semiconductor Manufacturing Conference

The conference serves semiconductor-industry executives, engineering and fab managers, academics, startup founders, financial analysts, market researchers, consulting firms, and consortia. Its stated focus is materials innovation, management, and business success; the 2027 agenda is not yet published.

ASME’s Manufacturing Engineering Division sponsors MSEC as a forum for advanced manufacturing research, with technical presentations, poster sessions, panels, workshops, and an early-career forum. It is co-located with NAMRI/SME’s 55th North American Manufacturing Research Conference and JSME’s International Conference on Leading Edge Manufacturing/Materials & Processing. Technical tracks include additive manufacturing (including smart, solid-state, metal and hybrid processes, multi-material processing, and sensor fusion); advanced materials manufacturing and semiconductor packaging; biomanufacturing; circular manufacturing and critical-material supply chains; manufacturing equipment, robotics, and automation; manufacturing processes and systems; in-space manufacturing; energy technologies; microelectronics metrology; and quality and reliability. Research themes include in-situ monitoring and control, digital twins, AI and machine learning, process qualification, and energy and material efficiency.

The event brings together the ACerS Annual Meeting, AIST Steel Properties & Applications, the TMS Fall Meeting, and the Advanced Materials Show. Planned technical symposia cover additive manufacturing, including modeling, AI and machine learning, process control, ceramic 3D printing, and qualification and certification of computational materials tools. Other materials topics include ceramics, glass, electronic and nanostructured materials, advanced alloys, and high-temperature phase transformations. Steel and ferrous-metallurgy programming addresses alloy design, steel processing and coatings, medium- and high-manganese steels, decarbonization, scrap recyclability, and materials for transportation, defense, energy, hydrogen, carbon capture, geothermal, and nuclear applications. Energy-focused symposia cover clean hydrogen, electrochemical storage and conversion, thermal management, and alternative-energy devices, including solid-state batteries, electrolyzers, fuel cells, and thermoelectric systems. Additional planned topics include corrosion and degradation in extreme environments, nuclear materials and waste-storage forms, and materials for advanced manufacturing. The co-located Advanced Materials Show focuses on high-performing materials technology and the materials manufacturing supply chain.

The technical symposia span ceramic and glass science, engineering, processing, and applications. Topics include ceramic interfaces and grain boundaries; oxide quantum materials; superconductivity, magnetism, and correlated phases; functional ceramics; extreme-environment and microelectronics materials; two-dimensional materials; high-entropy materials; bioceramics; glass surfaces and the glassy state; and computational modeling, data science, and AI/ML for materials discovery and manufacturing. Energy-related subjects include materials for energy storage and conversion, nuclear energy applications, protonic ceramic cells, and materials for a sustainable and resilient energy future. Manufacturing topics include advanced ceramic processing, additive manufacturing, glass manufacturing scale-up, and intelligent manufacturing. The additive-manufacturing symposium covers feedstock design, printing and post-processing, modeling, characterization, process-structure-property relationships, qualification, certification, scale-up, cost, reliability, and industrial implementation. The raw-materials symposium addresses material quality and variability, alternative and recycled feedstocks, sustainable sourcing, circularity, supply-chain resilience, resource security, and decarbonization.

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

SPCC combines technical sessions, poster presentations, and business-focused programming on surface preparation, cleaning technologies, and wet processes for semiconductor manufacturing. Technical topics include front-end, back-end, and packaging; cleaning equipment, materials, and metrology; advanced-memory challenges such as pattern collapse, contaminant removal from high-aspect-ratio structures, selective etching, and surface preparation for DRAM, 3D-NAND, and emerging memories; and wet and dry cleaning for FinFET, gate-all-around, nanosheet, nanowire, and CFET devices. Other areas include post-etch and post-CMP cleaning, advanced interconnect and EUV mask cleaning, contamination control, high-purity water and chemical delivery, in-situ monitoring, process control and AI/machine learning, trace-particle and metal detection, and sustainability. The scope also includes surface preparation for Ge, III-V, GaN, SiC, and 2D systems, as well as photovoltaics, MEMS, and nanoelectronics. Business-focused programming addresses macroeconomic, market, and structural trends shaping the global semiconductor industry, including industry dynamics, supply chain, and strategic outlook.

Technical programming includes presentations, panels, tutorials, and discussions in materials and process engineering. The exhibition features materials, equipment, processes, and solutions from companies across the supply chain. Themes span advanced materials and processes applied in aerospace, defense, transportation, energy, manufacturing, and other industries, connecting technical knowledge with real-world applications. Technical papers selected for the conference program undergo review by subject-matter experts and must include tests, analysis, and results. The program also includes ITAR-restricted technical presentations on defense-related materials and manufacturing; participation in those sessions requires applicable clearance.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

A multidisciplinary materials research program covering electronics, optics and photonics; energy and sustainability; manufacturing; materials theory, computation and data science; nanomaterials; quantum materials, heterostructures and devices; soft materials and biomaterials; and structural and functional materials. Critical-minerals topics include advanced characterization, AI/ML and materials for enhanced critical minerals recovery and separation, and materials innovation for ultra-pure critical minerals from fundamental science to industrial scaling. Energy symposia address data-driven processing for scalable energy-storage materials manufacturing, earth-abundant active materials for Li-ion batteries, lithium-based battery characterization and computation, critical-material-free chemistries beyond Li-ion, solid-state battery interfaces and processing, solar-energy materials, space photovoltaics, and advanced nuclear fuel and cladding. Manufacturing topics include multiscale additive manufacturing, from nano-architected materials to macroscale structures; sustainable electronics; and processing and manufacturing pathways for emerging electrochemical energy storage. Other subjects include in situ and operando electron and X-ray microscopy, 4D-STEM and AI-enabled imaging; AI-ready materials research platforms; quantum sensing and superconducting materials; soft electronics, biohybrid materials and biosensing.