IEEE International MTT Symposia (IMS)

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The program includes technical programming, tutorial programming, the Opening Session and EDFAS General Meeting, IPFA and ESREF Best Paper Presentations, the Women in Electronics Failure Analysis session, International Roadmap for Failure Analysis programming, and user-group discussions covering integrated PFA, OFI and system-in-package analysis, sample preparation, FIB, AI, and nanoprobing/SPM. Additional programming includes a peer exchange on funding failure-analysis laboratories and a panel on design for analysis, backside power, heterogeneous integration, and co-packaged optics in the AI era.

A multidisciplinary materials research program covering electronics, optics and photonics; energy and sustainability; manufacturing; materials theory, computation and data science; nanomaterials; quantum materials, heterostructures and devices; soft materials and biomaterials; and structural and functional materials. Critical-minerals topics include advanced characterization, AI/ML and materials for enhanced critical minerals recovery and separation, and materials innovation for ultra-pure critical minerals from fundamental science to industrial scaling. Energy symposia address data-driven processing for scalable energy-storage materials manufacturing, earth-abundant active materials for Li-ion batteries, lithium-based battery characterization and computation, critical-material-free chemistries beyond Li-ion, solid-state battery interfaces and processing, solar-energy materials, space photovoltaics, and advanced nuclear fuel and cladding. Manufacturing topics include multiscale additive manufacturing, from nano-architected materials to macroscale structures; sustainable electronics; and processing and manufacturing pathways for emerging electrochemical energy storage. Other subjects include in situ and operando electron and X-ray microscopy, 4D-STEM and AI-enabled imaging; AI-ready materials research platforms; quantum sensing and superconducting materials; soft electronics, biohybrid materials and biosensing.

IEDM's future dates list this edition at Hilton Union Square San Francisco. The conference covers technological breakthroughs in semiconductor and electronic device technology, design, manufacturing, physics, and modeling. Its scope includes nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, process technology, device modeling and simulation, silicon, compound and organic semiconductors, and emerging material systems.

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

The event brings together the ACerS Annual Meeting, AIST Steel Properties & Applications, the TMS Fall Meeting, and the Advanced Materials Show. Planned technical symposia cover additive manufacturing, including modeling, AI and machine learning, process control, ceramic 3D printing, and qualification and certification of computational materials tools. Other materials topics include ceramics, glass, electronic and nanostructured materials, advanced alloys, and high-temperature phase transformations. Steel and ferrous-metallurgy programming addresses alloy design, steel processing and coatings, medium- and high-manganese steels, decarbonization, scrap recyclability, and materials for transportation, defense, energy, hydrogen, carbon capture, geothermal, and nuclear applications. Energy-focused symposia cover clean hydrogen, electrochemical storage and conversion, thermal management, and alternative-energy devices, including solid-state batteries, electrolyzers, fuel cells, and thermoelectric systems. Additional planned topics include corrosion and degradation in extreme environments, nuclear materials and waste-storage forms, and materials for advanced manufacturing. The co-located Advanced Materials Show focuses on high-performing materials technology and the materials manufacturing supply chain.

The week combines the SATELLITE Conference, GovMilSpace, a peer-evaluated Tech Seminar, an executive Inner Circle program, and an exhibit hall. Topics include satellite finance, M&A and market structure; 5G non-terrestrial networks and the road to 6G; direct-to-device connectivity; AI in satellite operations; software-defined networks; sovereign networks; launch economics; and ground-segment modernization. GovMilSpace addresses acquisition and commercial integration, resilient architectures, GEOINT, PNT, defense constellation services, optical communications, and the space industrial base. The Tech Seminar covers ground architecture, spectrum, propulsion, AI, and in-space operations, with white papers accompanying its technical sessions. The program also includes discussions of satellite manufacturing costs and supply-chain pressures, spectrum policy ahead of WRC-27, satellite-network security and interference testing, and orbital logistics. Some Inner Circle briefings and roundtables are exclusive to that executive program.

The technical program includes a joint AeroMat symposium on advanced coatings for aerospace and industrial gas turbines, including thermal and environmental barrier coatings, turbine clearance control, load-bearing and tribological coatings, component repair, and cold spray for aerospace applications. Research and development topics include AI and machine learning for materials and process informatics; modeling and simulation; carbon neutrality, environmental impacts, and life-cycle analysis; characterization methods; cold-spray fundamentals and particle impact; aerosol deposition; novel coatings and feedstock materials; and hybrid, laser, and additive manufacturing processes. Application areas include automotive and medical uses; battery and sustainable-energy applications; electronics and semiconductor manufacturing equipment; thermal-spray additive manufacturing; equipment, powders, consumables, and economics; circular-economy repair and remanufacturing; and wear and corrosion protection across energy, oil and gas, marine, manufacturing, construction, and food processing. The conference also includes oral and poster presentations, panel discussions, keynote presentations, and an industrial forum. The co-located exposition features thermal-spray equipment, advanced surface solutions, additive manufacturing technologies, consumables, and applied research.