ISTFA 2027

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

The program brings together the RF Integrated Circuits (RFIC), RF Systems & Applications (RFSA), and RF Technology & Techniques (RFTT) symposia, followed by the ARFTG Microwave Measurement Conference. The week also includes technical sessions, workshops, panels, plenary sessions, interactive forums, an exhibition, an Executive Forum, and a co-located IEEE Hard Tech Venture Summit. RFIC covers RF through THz integrated circuits and systems, including power amplifiers, front-end modules, oscillators, high-speed interconnects, advanced packaging, and applications such as wireless, radar, satellite communications, sensing, quantum systems, and AI-assisted design. RFSA addresses system-level research and applications including communications, radar, biomedical systems, phased arrays, non-terrestrial communications, and integrated sensing and communications. RFTT covers passive components, filters, packaging and 3D manufacturing, semiconductor technologies, circuit and system CAD, computational electromagnetics, quantum circuits, and sub-THz/THz circuits.

Technical programming includes presentations, panels, tutorials, and discussions in materials and process engineering. The exhibition features materials, equipment, processes, and solutions from companies across the supply chain. Themes span advanced materials and processes applied in aerospace, defense, transportation, energy, manufacturing, and other industries, connecting technical knowledge with real-world applications. Technical papers selected for the conference program undergo review by subject-matter experts and must include tests, analysis, and results. The program also includes ITAR-restricted technical presentations on defense-related materials and manufacturing; participation in those sessions requires applicable clearance.

The program includes keynotes, panels, breakouts, and interactive roundtables on steel-industry conditions; fabrication businesses, leadership, and industry outlook; AI and digitization in manufacturing; shop-floor equipment use cases and return on investment; and manufacturing’s economic and financial outlook. Sessions also address profitability, capital investment, business growth, tariffs, steel, leadership development, recruitment, small- and midsize-manufacturer growth, and potential changes to tax policy, OSHA and EPA regulations, and tariffs. Roundtable topics include culture, marketing, AI, and operations.

The workshop covers advancements, challenges, and gaps in flexible hybrid electronics, hybrid electronics, and bio-signal sensing for real-time cognitive and physical state monitoring and augmentation, and includes AI for Metrology (AI4MT) sessions. Day 1, the Innovation Forum, features technical presentations on advances from FlexTech and NBMC. Day 2, Technical Gap Analysis, uses collaborative breakout sessions to examine technology gaps and roadmaps, shape FlexTech and NBMC research priorities, and inform future Request for Proposal directions. Day 3, the AI for Metrology Workshop, explores connecting metrology, failure-analysis, and test data across the semiconductor supply chain. Topics include AI-assisted defect localization and root-cause analysis, non-destructive modalities, targeted physical characterization, chiplets, heterogeneous integration, and advanced packaging. Industry tours at SkyWater Technology and NeoCity Academy are also listed.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The technical program solicits new, significant work relevant to the nuclear industry, with summaries and abstracts presented orally. Topics include advanced reactors and power systems; energy storage integration with nuclear plants; fusion; nuclear fuel recycling, waste forms, transmutation and disposal; AI applications in nuclear safety and materials research; nuclear nonproliferation; advanced and additive manufacturing; and thermal hydraulics. Embedded topics include Decommissioning Environmental Sciences and Remote Technology, covering robotics and remote systems, decommissioning, environmental remediation, nuclear cleanup, used-fuel management, and related AI, digital-twin and regulatory topics. Accelerator Applications covers accelerator facilities and design, nuclear data, materials science, medical and industrial applications, security and forensics, and environmental studies. Accepted and presented summaries are slated for publication in ANS Transactions.

SPCC combines technical sessions, poster presentations, and business-focused programming on surface preparation, cleaning technologies, and wet processes for semiconductor manufacturing. Technical topics include front-end, back-end, and packaging; cleaning equipment, materials, and metrology; advanced-memory challenges such as pattern collapse, contaminant removal from high-aspect-ratio structures, selective etching, and surface preparation for DRAM, 3D-NAND, and emerging memories; and wet and dry cleaning for FinFET, gate-all-around, nanosheet, nanowire, and CFET devices. Other areas include post-etch and post-CMP cleaning, advanced interconnect and EUV mask cleaning, contamination control, high-purity water and chemical delivery, in-situ monitoring, process control and AI/machine learning, trace-particle and metal detection, and sustainability. The scope also includes surface preparation for Ge, III-V, GaN, SiC, and 2D systems, as well as photovoltaics, MEMS, and nanoelectronics. Business-focused programming addresses macroeconomic, market, and structural trends shaping the global semiconductor industry, including industry dynamics, supply chain, and strategic outlook.

Technical programming covers aerospace materials and applications, including additive manufacturing; advanced forming and thermomechanical processing; aerospace coatings; AI and integrated computational materials engineering; composite materials and structures; emerging materials and processes; extreme-environment and gas-turbine materials; light alloy technology; low-cost manufacturing and affordable structures; materials characterization and failure analysis; modeling and simulation of manufacturing processes; multifunctional materials; residual stress for aerospace components; space and cryogenic applications; sustainable and enabling materials and processes; titanium alloys and manufacturing technologies; tribology and wear of aerospace materials; and welding and joining. The conference also includes keynote presentations, panel discussions, an exposition, and professional development opportunities. The detailed schedule and keynote lineup have not yet been published.