IEEE International Electron Devices Meeting

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

An international technical conference on solutions for improving semiconductor manufacturing. Technical presentations highlight industry innovations with specific results, and papers presented at the conference are peer-reviewed by the ASMC Technical Committee; select manuscripts are published in the IEEE Transactions on Semiconductor Manufacturing special section. The 2027 call for abstracts covers Advanced Equipment Processes and Materials; Advanced Metrology; Advanced Process Control; Defect Free Manufacturing; Defect Inspection and Reduction; Big Data Management and Cybersecurity; Equipment Optimization; Manufacturing for Sustainability; Novel Device Technologies; Patterning, Design & Technology Optimization; and Smart Manufacturing & Factory Operations.

The meeting spans materials science research in quantum materials, energy and sustainability, semiconductors, nanomaterials, soft materials and biomaterials, and structural and functional materials. Symposia address sustainable materials chemistry and processing for lithium and earth-abundant batteries; sodium-ion storage; materials, characterization and manufacturing for solid-state batteries; next-generation EV battery materials; hydrogen storage and transmission; and electrochemical conversion of CO₂ and nitrogen compounds into sustainable products. Other topics include AI-driven materials design and autonomous science, chiplet architectures, 2D materials for microelectronics and neuromorphic computing, additive manufacturing across length scales, high-entropy materials, and resilient materials for fission and fusion reactors. Featured programming includes a plenary on critical elements from urban mines and decarbonization of the metal sectors, a keynote on progress and challenges toward an inertial fusion energy future, and sessions on bioelectronics translation and silicon photonics, optical connectivity, sensing, data centers and commercialization.

The program brings together the RF Integrated Circuits (RFIC), RF Systems & Applications (RFSA), and RF Technology & Techniques (RFTT) symposia, followed by the ARFTG Microwave Measurement Conference. The week also includes technical sessions, workshops, panels, plenary sessions, interactive forums, an exhibition, an Executive Forum, and a co-located IEEE Hard Tech Venture Summit. RFIC covers RF through THz integrated circuits and systems, including power amplifiers, front-end modules, oscillators, high-speed interconnects, advanced packaging, and applications such as wireless, radar, satellite communications, sensing, quantum systems, and AI-assisted design. RFSA addresses system-level research and applications including communications, radar, biomedical systems, phased arrays, non-terrestrial communications, and integrated sensing and communications. RFTT covers passive components, filters, packaging and 3D manufacturing, semiconductor technologies, circuit and system CAD, computational electromagnetics, quantum circuits, and sub-THz/THz circuits.

A multidisciplinary materials research program covering electronics, optics and photonics; energy and sustainability; manufacturing; materials theory, computation and data science; nanomaterials; quantum materials, heterostructures and devices; soft materials and biomaterials; and structural and functional materials. Critical-minerals topics include advanced characterization, AI/ML and materials for enhanced critical minerals recovery and separation, and materials innovation for ultra-pure critical minerals from fundamental science to industrial scaling. Energy symposia address data-driven processing for scalable energy-storage materials manufacturing, earth-abundant active materials for Li-ion batteries, lithium-based battery characterization and computation, critical-material-free chemistries beyond Li-ion, solid-state battery interfaces and processing, solar-energy materials, space photovoltaics, and advanced nuclear fuel and cladding. Manufacturing topics include multiscale additive manufacturing, from nano-architected materials to macroscale structures; sustainable electronics; and processing and manufacturing pathways for emerging electrochemical energy storage. Other subjects include in situ and operando electron and X-ray microscopy, 4D-STEM and AI-enabled imaging; AI-ready materials research platforms; quantum sensing and superconducting materials; soft electronics, biohybrid materials and biosensing.

The published 2027 track framework covers electronic design across chip, board, package, and system levels. Topics include signal and power integrity for die, chiplets, interposers, and packaging; chip I/O and power modeling; photonics and wireless integration; PCB, module, and package materials and processing; and memory/HBM, chiplet, multi-die, and 3DIC/SiP interfaces. Other tracks address system co-design and modeling; high-speed links; jitter, noise, and error-ratio measurement and simulation; signal processing, modulation, equalization, and forward error correction; power delivery; EMC/EMI; test and measurement; and interconnect modeling and optimization. The machine-learning and AI track includes electronics design automation, behavioral models, system analytics, and performance optimization. Advanced automotive electronics topics include EV and autonomous systems, sensing, in-vehicle communications, charging, battery technology, and automotive testing. The conference format includes technical sessions, panels, tutorials, and boot camps.

The program covers medical-device design and development, next-generation technologies, regulatory compliance, cybersecurity, supply-chain resilience, quality, and manufacturing operations. Conference topics include market readiness and adoption of medical devices; scaling miniaturized devices from prototype to production; signal integrity and EMI for medical imaging and AI-driven devices; AI-based demand forecasting; changes to FDA inspections and the Quality Management System Regulation (QMSR); 3D printing of bioabsorbable implants; and robotics and AI in pharmaceutical manufacturing. Show-floor education also addresses digital transformation, AI adoption, workforce transformation, smart manufacturing, automation, packaging, additive manufacturing, and sustainable operations. Workshops address digital lean manufacturing using automation, AI, robotics, and data analytics; OT/IT integration and smart-manufacturing roadmaps; and sterilization technologies including supercritical carbon dioxide, vaporized hydrogen peroxide, chlorine dioxide, nitrogen dioxide, electron beam, and X-ray. Sterilization topics include validation, material compatibility, scalability, regulatory expectations, and lower-emission approaches. The leadership program covers mentorship, leadership credibility, difficult conversations, decision fatigue, and burnout.