DesignCon 2027

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

An in-person technical conference on land- and sea-based transportation systems, propulsion, mobility, and energy systems. The program covers internal-combustion engines, including off-road, rail, marine, light-duty and heavy-duty systems; fuels, lubricants, carbon management; combustion, emissions control; and powertrain modeling and simulation. Electrification topics include batteries and light-duty EVs, heavy-duty and off-road vehicle electrification, hybrid and alternative powertrains, and rail and marine electrification. A sustainability and policy area addresses lifecycle assessment of transport modes, components, critical automotive materials and minerals, and low-carbon fuels and energy carriers. Additional tracks cover AI and machine learning for engines, powertrains, vehicle systems and thermal management; connected and automated systems, including vehicle safety, cybersecurity, sensing, freight transportation, predictive control and software-defined vehicle architectures. Technical posters provide for work-in-progress, research results and practical case studies across the conference topics.

The program includes plenary sessions with invited speakers, oral and poster technical sessions presenting original work, tutorials, and exhibits. The conference focuses on advances in the design, operation, analysis, and applications of electric machines and drives. Topics include rotating electric machines; electric drives and advanced motor controls; special machines, electromagnetic actuators, and sensors; thermal, materials, and efficiency issues; design optimization, modeling, and simulation; condition monitoring, fault diagnosis, and prognosis; transportation applications; energy and grid-connected applications; reduced- or critical-magnet-free machines; and AI/ML applications in machine design and optimization. Tutorial topics also include automation and robotics, medium-voltage machines and drives, and artificial intelligence in electric drives. Special-session proposals emphasize AI-based motor and drive design optimization, digital twins, predictive maintenance and IoT, and actuators and drives for emerging applications. Accepted and presented papers are to be published in the conference proceedings and submitted to IEEE Xplore. Papers may also be submitted to specified IEEE journals under each journal’s rules.

Trade show and conference covering automation across manufacturing, logistics, healthcare, energy, and other industries. The conference combines show-floor technology exploration with expert-led sessions; its 2027 programming and speakers are still in development. Show-floor programming includes Keynote Stage presentations, Show Theater sessions and panels on emerging technologies, practical applications, and market trends, and Innovation Stage presentations featuring new hardware, software, technologies, and approaches to work. Other featured programming includes startup pitches, live demos, the Startup Challenge, Innovation Awards, Humanoid Pavilion & Stage, and AMR technology demos.

The technical program combines peer-reviewed lecture and poster presentations, industry presentations, professional education seminars, plenary programming, and expert debates. Seminar themes include wide-bandgap device reliability, AI in power electronics, magnetics, converter topologies, electromagnetic compatibility and motor drives, and data-center power delivery. Specific topics include SiC and GaN switching behavior, online condition monitoring, AI-assisted converter design, planar magnetics, solid-state transformers, electric drives and e-mobility, and power delivery for AI accelerators and data centers. Technical and industry programming addresses modeling and simulation, data-center power systems, inverter design, chargers, power devices, test and characterization, and integrated voltage regulators. Debate topics include integrated voltage regulator roadmaps and roadblocks, whether solid-state transformers are ready for deployment, and whether future power-electronics breakthroughs will come from academia or industry. APEC is sponsored by the Power Sources Manufacturers Association, IEEE Power Electronics Society, and IEEE Industry Applications Society.

The program brings together energy, industrial transformation, and advanced manufacturing, with cross-cutting themes of workforce development, standards, finance, AI and digital transformation, policy, and resilience planning. Roundtables, workshops, and demos are designed to address tradeoffs involving affordability, risk, standardization, and deployment speed. Program tracks include Powering Growth, with sample sessions on data-center power and cooling, new nuclear deployment, solar cost reduction, and scaling geothermal; Industry Reimagined, covering industrial heat electrification, next-generation steel, and EPC project-delivery costs and risks; Next-Gen Manufacturing, addressing hardware investment and bankability, additive manufacturing, and sustainability tradeoffs in product design; and Future Workforce, on nuclear workforce readiness, apprenticeships, and aligning training programs with real projects. Additional sessions are in development in areas including energy storage, fusion, industrial efficiency, critical minerals, and sustainability tradeoffs. The listed sessions are samples and subject to change.

An international technical conference on solutions for improving semiconductor manufacturing. Technical presentations highlight industry innovations with specific results, and papers presented at the conference are peer-reviewed by the ASMC Technical Committee; select manuscripts are published in the IEEE Transactions on Semiconductor Manufacturing special section. The 2027 call for abstracts covers Advanced Equipment Processes and Materials; Advanced Metrology; Advanced Process Control; Defect Free Manufacturing; Defect Inspection and Reduction; Big Data Management and Cybersecurity; Equipment Optimization; Manufacturing for Sustainability; Novel Device Technologies; Patterning, Design & Technology Optimization; and Smart Manufacturing & Factory Operations.

The conference brings together engineers, designers, managers, and educators to exchange expertise, best practices, challenges, and application developments in additive manufacturing. The program includes keynote presentations, technical sessions, panel discussions, training sessions, hands-on workshops, the Technical Competition, the Innovators Showcase, and AMUGexpo. Tracks cover aerospace and defense applications such as flight-certified parts, satellite components, qualification, repair, and sustainment; automotive, infrastructure, energy, and battery applications; business topics including capital equipment, return on investment, market research, and mergers and acquisitions; and design, metrology, scanning, and in-situ monitoring. Other track areas include additive manufacturing education and standards; emerging technologies and research-to-industry translation; healthcare and dental applications; industrial automation, tooling, hybrid manufacturing, robotics, and digital thread; materials, powder recycling, feedstock innovation, heat treatment, and post-processing; manufacturing safety and cybersecurity; and simulation, AI, digital twins, and process optimization. Attendance is limited to individuals from organizations that directly own commercially available additive manufacturing equipment used in a professional environment.