2027 IEEE International Electric Machines and Drives Conference (IEMDC-2027)

Hosted by the Society of American Military Engineers, the conference brings together military, government, industry, and academic professionals to address engineering solutions for national security, infrastructure resilience, readiness, and mission success. Programming includes technical sessions, workshops, panels, leadership and professional-development discussions, federal acquisition insights, emerging technologies, and an expo featuring solutions for mission readiness and infrastructure modernization.

An in-person technical conference on land- and sea-based transportation systems, propulsion, mobility, and energy systems. The program covers internal-combustion engines, including off-road, rail, marine, light-duty and heavy-duty systems; fuels, lubricants, carbon management; combustion, emissions control; and powertrain modeling and simulation. Electrification topics include batteries and light-duty EVs, heavy-duty and off-road vehicle electrification, hybrid and alternative powertrains, and rail and marine electrification. A sustainability and policy area addresses lifecycle assessment of transport modes, components, critical automotive materials and minerals, and low-carbon fuels and energy carriers. Additional tracks cover AI and machine learning for engines, powertrains, vehicle systems and thermal management; connected and automated systems, including vehicle safety, cybersecurity, sensing, freight transportation, predictive control and software-defined vehicle architectures. Technical posters provide for work-in-progress, research results and practical case studies across the conference topics.

The technical program combines peer-reviewed lecture and poster presentations, industry presentations, professional education seminars, plenary programming, and expert debates. Seminar themes include wide-bandgap device reliability, AI in power electronics, magnetics, converter topologies, electromagnetic compatibility and motor drives, and data-center power delivery. Specific topics include SiC and GaN switching behavior, online condition monitoring, AI-assisted converter design, planar magnetics, solid-state transformers, electric drives and e-mobility, and power delivery for AI accelerators and data centers. Technical and industry programming addresses modeling and simulation, data-center power systems, inverter design, chargers, power devices, test and characterization, and integrated voltage regulators. Debate topics include integrated voltage regulator roadmaps and roadblocks, whether solid-state transformers are ready for deployment, and whether future power-electronics breakthroughs will come from academia or industry. APEC is sponsored by the Power Sources Manufacturers Association, IEEE Power Electronics Society, and IEEE Industry Applications Society.

The published 2027 track framework covers electronic design across chip, board, package, and system levels. Topics include signal and power integrity for die, chiplets, interposers, and packaging; chip I/O and power modeling; photonics and wireless integration; PCB, module, and package materials and processing; and memory/HBM, chiplet, multi-die, and 3DIC/SiP interfaces. Other tracks address system co-design and modeling; high-speed links; jitter, noise, and error-ratio measurement and simulation; signal processing, modulation, equalization, and forward error correction; power delivery; EMC/EMI; test and measurement; and interconnect modeling and optimization. The machine-learning and AI track includes electronics design automation, behavioral models, system analytics, and performance optimization. Advanced automotive electronics topics include EV and autonomous systems, sensing, in-vehicle communications, charging, battery technology, and automotive testing. The conference format includes technical sessions, panels, tutorials, and boot camps.

FutureGrid brings together researchers, utilities, industry leaders, technology developers, and policymakers to shape the future of the electric grid. The conference focuses on technologies, challenges, and solutions transforming power generation, transmission, distribution, and grid operation, including renewable and distributed energy resources, inverter-based resources, energy storage, transmission expansion, microgrids, HVDC, grid stability and control, protection, reliability, resilience, and grid modernization. The program also explores forces reshaping the grid, including AI and machine learning, data centers and large loads, electrification, cybersecurity, power electronics, and energy markets. Through technical papers, industry panels, GridSchool tutorials and workshops, special sessions, and an expanded expo, the event connects academia, utilities, and industry around a reliable, resilient, intelligent, and sustainable grid. It is sponsored by the IEEE Industry Applications Society, Industrial Electronics Society, Power & Energy Society, and Power Electronics Society.

The conference focuses on innovative technologies, research and design advances, and solutions for renewable and sustainable energy, including utility-level systems integration. Selected papers may be considered for publication in an ASME journal. Tracks cover AI for energy systems; heat pump, refrigeration and cryogenic technology; sustainable and resilient buildings; energy storage; hybrid systems and microgrids; solar optics, thermal applications, chemistry and fuels; photovoltaic and electrochemical technologies, including batteries and fuel cells; waste heat recovery, thermal desalination and water harvesting; alternative energy conversion, including geothermal, nuclear, wind, hydro, ocean and wave energy; hydrogen, bioenergy, biofuels and sustainable fuels; combustion, cogeneration and carbon capture, storage and utilization; advanced energy materials and manufacturing; space energy systems and in situ resource utilization; critical mineral recovery and supply chains; data center energy-water and cooling; and sustainability, safety, durability and recyclability of electrochemical storage. The program also includes lightning talks and poster presentations.

An international technical conference on solutions for improving semiconductor manufacturing. Technical presentations highlight industry innovations with specific results, and papers presented at the conference are peer-reviewed by the ASMC Technical Committee; select manuscripts are published in the IEEE Transactions on Semiconductor Manufacturing special section. The 2027 call for abstracts covers Advanced Equipment Processes and Materials; Advanced Metrology; Advanced Process Control; Defect Free Manufacturing; Defect Inspection and Reduction; Big Data Management and Cybersecurity; Equipment Optimization; Manufacturing for Sustainability; Novel Device Technologies; Patterning, Design & Technology Optimization; and Smart Manufacturing & Factory Operations.

The conference focuses on the customer-utility interface, including planning, demand management, distributed energy resources, storage, DERMS, energy efficiency, interconnection, standardization, scalability, AI, data center growth, and next-generation loads. The program includes tutorials, technical tours, welcome and opening remarks with a keynote, breakout sessions, exhibits, stage presentations, startup lightning pitches, a poster session, and a closing session. Super Sessions address generation mix and grid reliability; data center growth and the AI economy; flexible load management; AI for planning, operations, and reliability; and asset management for an affordable grid. The program also includes an invite-only Innovation Challenge and brings together utility engineers, planners, consultants, developers working on large-load interconnections, AI and data-center leaders, DER providers, policymakers, regulators, and researchers in data, cybersecurity, and grid-edge systems. PacifiCorp is the host utility.

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.