Tohoku University

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The technical symposia span ceramic and glass science, engineering, processing, and applications. Topics include ceramic interfaces and grain boundaries; oxide quantum materials; superconductivity, magnetism, and correlated phases; functional ceramics; extreme-environment and microelectronics materials; two-dimensional materials; high-entropy materials; bioceramics; glass surfaces and the glassy state; and computational modeling, data science, and AI/ML for materials discovery and manufacturing. Energy-related subjects include materials for energy storage and conversion, nuclear energy applications, protonic ceramic cells, and materials for a sustainable and resilient energy future. Manufacturing topics include advanced ceramic processing, additive manufacturing, glass manufacturing scale-up, and intelligent manufacturing. The additive-manufacturing symposium covers feedstock design, printing and post-processing, modeling, characterization, process-structure-property relationships, qualification, certification, scale-up, cost, reliability, and industrial implementation. The raw-materials symposium addresses material quality and variability, alternative and recycled feedstocks, sustainable sourcing, circularity, supply-chain resilience, resource security, and decarbonization.