Semiconductors Conferences & Events in the US — 2026
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This 2026 US calendar covers semiconductor industry meetings, forums, conferences, trade-focused events, and assembly gatherings. Attendees typically include semiconductor equipment and materials professionals, international trade partners, electronics manufacturing and assembly specialists, researchers, engineers, and business leaders. Events are located in the San Francisco Bay Area, Honolulu, Phoenix, and Chicago.
Recurring themes include industry networking, international trade opportunities, semiconductor business development, electronic specialty gases and systems, assembly technologies, and electronic-device research. The sample includes SEMI meetings and forums, the ESGS conference, the Global Chamber Semiconductor Opportunities Special Event PHX, The ASSEMBLY Show, and the IEEE International Electron Devices Meeting.
Highlighted events
OCT
27
TUE
–
OCT
29
THU
The ASSEMBLY Show
NotableThe ASSEMBLY Show (BNP Media) · Rosemont (Chicago), IL
Automotive · Robotics & Automation · SemiconductorsThe program combines an assembly manufacturing conference and expo with The Quality Show in partnership. Tracks include Automated Assembly, AI in Manufacturing, Continuous Improvement & Operational Excellence, Design, Lean Manufacturing and Workforce Development, Quality Leadership, Culture & Workforce, Quality Systems, Inspection & Compliance, and Soldering. Featured sessions address robotic automation for high-mix, low-volume heat exchanger fabrication; press data and autonomous assembly; AI-driven compliance; shop-floor buy-in and data trust; soft sensors for industrial systems; cost of quality; sensor-driven assembly; machine vision for precision automated metrology; cost engineering; selective soldering; and preparation of the new collar workforce for smart factories. The program also includes an AI in Manufacturing keynote panel with Girish Gopalakrishnan, Roy Devadas, John Platais, and Jung Yoon, plus an Automated Assembly Systems panel with John Sprovieri, Bernard Misiak, Steven Benvenuto, and Tim Tate. Additional programming covers ASQ-MQD subjects including calibration, measurement uncertainty, VDA 5 and AIAG MSA, ISO/IEC 17025, artificial intelligence foundations, internal auditing, and risk management. Embedded guided tours cover fastening and joining technologies, smart assembly automation and robotics, connected factory data and traceability, and quality and process verification. Named presenters include executives, engineers, manufacturing specialists, quality professionals, and technology leaders from General Motors, IBM Supply Chain, ESAB, Stratasys, Milwaukee Tool, ITW, ZF, PPG Industries, Epson Robots, Edgewater Automation, and other manufacturing organizations.
NOV
1
SUN
–
NOV
4
WED
SEMI (Semiconductor Equipment and Materials International) · Kapolei (Honolulu), HI
SemiconductorsITPC is an executive thought-leadership and relationship-building conference focused on global semiconductor manufacturing, supply chains, economic trends, geopolitics, technology, markets, and applications. The program includes keynotes from semiconductor leaders; Markets & Applications presentations; a Technology session and panel; a Future Playgrounds session covering advanced power and energy technologies; and a Trade & Politics program with geopolitical and public-policy discussions. Named participants include Janice Golda, Sr. Director, Lithography Strategic Sourcing, Intel; Joe Stockunas, President, SEMI Americas; Ajit Manocha, President & CEO, SEMI; Marco Pieters, Chief Technology Officer, ASML; Sangjin Hyun, Corporate EVP & Head of Advanced Process Development Team, Samsung Electronics; Tomoharu Watanabe, Executive Vice President and Executive Officer, KIOXIA; Young Mann Cho, Head of R&D Technology Development, SK hynix; Yasumitsu Orii, Senior Managing Executive Officer and Head of Engineering Center, Rapidus; Mario Morales, Head of Corporate Strategy and Partnerships, AMD; Masaru Tsuchiya, Partner, McKinsey & Co Japan; Myung-Hee Na, VP, Technology Research, Intel; Thomas Sonderman, CEO and Director, SkyWater Technology; Om Nalamasu, CTO and Senior VP, Applied Materials; Pat Gelsinger, General Partner, Playground Global; Mikal Bøe, Founder and CEO, CORE POWER; Royal Kastens, VP, Global Public Policy & Advocacy, SEMI; John Seaton, Founding Partner and Bloomberg Contributor, Echo Canyon Consulting; and panelists from KIOXIA, Nexperia, Teradyne, Samsung, Intel, and Advantest.
DEC
12
SAT
–
DEC
16
WED
IEEE International Electron Devices Meeting (IEDM) · San Francisco (San Francisco Bay Area), CA
Electronics · SemiconductorsThe program covers semiconductor and electronic device technology, design, manufacturing, physics, modeling, and emerging computing architectures. It includes keynote presentations, technical paper sessions, tutorials, short courses, industry panels, and exhibits. Keynotes address “AI Driven Semiconductor Paradigm Shift: Optimizing the Semiconductor Industry from Device Scaling to System Integration,” “Driving AI Memory Innovation: From Device Technology to AI Memory Platform,” and “Technology Trends in the IDM Semiconductor Business.” Tutorials cover transistor evolution from planar devices to nanosheets and beyond; chiplets, heterogeneous integration, and 3D stacking; memory technologies and system co-optimization in the AI era; AI in physics-based semiconductor modeling; diverse memory technologies for adaptive computing; and advanced optical devices and wafer-scale assembly for co-packaged optics and optical I/O. The short-course program addresses distributed network design for AI, angstrom-era logic scaling, edge-device performance and design-technology/system-technology co-optimization, atomic-layer processing, advanced-packaging reliability, cryogenic electronics, memory-centric computing, HBM, oxide-semiconductor-channel DRAM, NAND scaling, spintronics, and chiplet and advanced-packaging technologies for AI and HPC systems.
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