72nd Annual IEEE International Electron Devices Meeting

Date

December 12

Format

In-Person

Location

San Francisco, CA

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About

The program covers semiconductor and electronic device technology, design, manufacturing, physics, modeling, and emerging computing architectures. It includes keynote presentations, technical paper sessions, tutorials, short courses, industry panels, and exhibits. Keynotes address “AI Driven Semiconductor Paradigm Shift: Optimizing the Semiconductor Industry from Device Scaling to System Integration,” “Driving AI Memory Innovation: From Device Technology to AI Memory Platform,” and “Technology Trends in the IDM Semiconductor Business.” Tutorials cover transistor evolution from planar devices to nanosheets and beyond; chiplets, heterogeneous integration, and 3D stacking; memory technologies and system co-optimization in the AI era; AI in physics-based semiconductor modeling; diverse memory technologies for adaptive computing; and advanced optical devices and wafer-scale assembly for co-packaged optics and optical I/O. The short-course program addresses distributed network design for AI, angstrom-era logic scaling, edge-device performance and design-technology/system-technology co-optimization, atomic-layer processing, advanced-packaging reliability, cryogenic electronics, memory-centric computing, HBM, oxide-semiconductor-channel DRAM, NAND scaling, spintronics, and chiplet and advanced-packaging technologies for AI and HPC systems.

Speakers(22)

Naga Chandrasekaran

Executive Vice President, Chief Technology and Operations Officer, and General Manager, Intel Foundry

Yunik Son

Vice President of Device Technology Solution, SK Hynix

Fabio Gualandris

President, Quality, Manufacturing & Technology, STMicroelectronics

Larry Bair

Senior Director, Silicon Design Engineering, AMD

Oliver Noblanc

Director, Process Integration R&D, ST Micro

Fatih Hamzaoglu

Intel Fellow, Intel

Pratheep Balasingam

Executive Director of R&D Engineering, Synopsys

Elisa Vianello

Senior Fellow, CEA-Leti

Joris Vancampenhout

Fellow, Silicon Photonics, Imec

Brad Beckmann

Fellow, AMD

Seung Hoon Sung

Principal Engineer, Intel

Jun Yuan

Senior Director, Qualcomm

Thorsten Lill

Executive, LAM

Yao-Chun Chuang

Deputy Director, TSMC

Loïck Le Guevel

IC Design Engineer, Google

Damien Querlioz

Research Director, Universite Paris-Saclay CNRS

HyunBae Lee

Distinguished Engineer, SK Hynix

Keiji Ikeda

Chief Specialist, Kioxia

Kishore Muchherla

Distinguished Member of Technical Staff, Micron

Akira Goda

Distinguished Member of Technical Staff, Micron

Shunsuke Fukami

Professor, Tohoku University

John Knickerbocker

Distinguished Engineer, IBM

Topics

AI
Engineering
Technology

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