2027 IEEE International Solid-State Circuits Conference (ISSCC)

Date

February 14, 2027

Format

In-Person

Location

San Francisco, CA

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About

Sponsored by IEEE and SSCS, the conference is a global forum for advances in solid-state circuits and systems-on-a-chip. The 2027 program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with parallel technical paper presentations, invited industry sessions, demonstrations, tutorials, Advanced-Circuit-Design Forums, a Student Research Preview, and a hardware-security short course. Plenary talks include “Holistic Semiconductor Lithography for the Age of AI” by Marco Pieters, Executive Vice President and Chief Technology Officer, ASML; “The Next Leap in Image Sensors: Pixels and Beyond in the AI Era” by Yusuke Oike, CTO / Senior Vice President, R&D, Sony Semiconductor Solutions; “At the End of the Copper Tunnel, There Is Light” by Matt Murphy, Chairman and CEO, Marvell; and “From Silicon to Deployed Infrastructure: Redefining the Semiconductor Design Challenge at Hyperscale” by Rani Borkar, President, Azure Hardware Systems and Infrastructure, Microsoft. Forums cover next-generation AI and HPC through memory, interconnect, power, and architecture co-design; 448G–3.2T wireline data converters; electrical and optical connectivity; AI-optimized sensing; 6G circuits and systems; and silicon systems for quantum sensing and computing. Tutorials address safe robotics, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerator design, energy-harvesting sensing, mm-wave LO scaling, analog design automation, radar LO generation, and die-to-die interfaces. The hardware-security short course covers fundamentals, cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Industry-focused sessions address commercial chip-product releases and topics including processors/SoCs, AI, machine learning, 5G, radar, wireline, quantum computing, automotive, healthcare, and robotics. The program also includes the panel “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”

Speakers(18)

Marco Pieters

Executive Vice President and Chief Technology Officer, ASML

Yusuke Oike

CTO / Senior Vice President, R&D, Sony Semiconductor Solutions

Matt Murphy

Chairman and CEO, Marvell

Rani Borkar

President, Azure Hardware Systems and Infrastructure, Microsoft

Caspar van Vroonhoven

Analog Devices

Mo Huang

University of Macau

Visvesh Sathe

Georgia Institute of Technology

Chi-Hang (Ivor) Chan

University of Macau

Priyanka Raina

Stanford University

Kiichi Niitsu

Kyoto University

Vadim Issakov

Braunschweig University of Technology

Xuan ‘Silvia’ Zhang

Northeastern University

Wu-Hsin Chen

Qualcomm Technologies

Didem Turker Melek

Cadence Design Systems

Todd Austin

University of Michigan

Patrick Schaumont

Worcester Polytechnic Institute

Makoto Nagata

Kobe University

Topics

AI
Engineering
Technology

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