Jimil M. Shah

The conference covers research, development, manufacturing, and applications in electronics packaging and heterogeneous integration, with technical paper presentations, panels, workshops, tutorials, keynote and technology talks, exhibits, and a joint poster session. Tracks address heterogeneous integration and multi-die assembly; data-center, modular-edge, server, and information-storage systems; electronic packaging for extreme environments; power/RF electronics and photonics; nanoscale and multiscale heat transfer and energy storage; flexible, wearable, and printed electronics; intelligent modeling, simulation, and automation; interactive presentations; and micro/nano mechatronics, microelectronics, and IoT. Topics include thermal management, reliability, advanced cooling, digital twins, AI and machine learning, additive deposition, sustainable inks, wide-bandgap semiconductors, phase-change heat transfer, extreme-environment materials, and energy systems. Plenary topics include hierarchical battery thermal management and modeling; AlN semiconductors; nanoscale wetting; data-center thermal management for AI; agentic AI cooling; and microelectronics for extreme environments. Panels address thermal and mechanical challenges in mobile, wireless, AI, IoT, automotive, and high-power-computing devices; liquid cooling from chip to cooling tower; two-phase cooling; mechanical design for electronics; packaging and data-center cooling reliability; and AI, simulation, and thermal engineering. Special sessions include next-generation AI data-center infrastructure, government, and reduced-order models.