InterPACK 2026

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

SPCC combines technical sessions, poster presentations, and business-focused programming on surface preparation, cleaning technologies, and wet processes for semiconductor manufacturing. Technical topics include front-end, back-end, and packaging; cleaning equipment, materials, and metrology; advanced-memory challenges such as pattern collapse, contaminant removal from high-aspect-ratio structures, selective etching, and surface preparation for DRAM, 3D-NAND, and emerging memories; and wet and dry cleaning for FinFET, gate-all-around, nanosheet, nanowire, and CFET devices. Other areas include post-etch and post-CMP cleaning, advanced interconnect and EUV mask cleaning, contamination control, high-purity water and chemical delivery, in-situ monitoring, process control and AI/machine learning, trace-particle and metal detection, and sustainability. The scope also includes surface preparation for Ge, III-V, GaN, SiC, and 2D systems, as well as photovoltaics, MEMS, and nanoelectronics. Business-focused programming addresses macroeconomic, market, and structural trends shaping the global semiconductor industry, including industry dynamics, supply chain, and strategic outlook.

The technical program combines peer-reviewed lecture and poster presentations, industry presentations, professional education seminars, plenary programming, and expert debates. Seminar themes include wide-bandgap device reliability, AI in power electronics, magnetics, converter topologies, electromagnetic compatibility and motor drives, and data-center power delivery. Specific topics include SiC and GaN switching behavior, online condition monitoring, AI-assisted converter design, planar magnetics, solid-state transformers, electric drives and e-mobility, and power delivery for AI accelerators and data centers. Technical and industry programming addresses modeling and simulation, data-center power systems, inverter design, chargers, power devices, test and characterization, and integrated voltage regulators. Debate topics include integrated voltage regulator roadmaps and roadblocks, whether solid-state transformers are ready for deployment, and whether future power-electronics breakthroughs will come from academia or industry. APEC is sponsored by the Power Sources Manufacturers Association, IEEE Power Electronics Society, and IEEE Industry Applications Society.

The published 2027 track framework covers electronic design across chip, board, package, and system levels. Topics include signal and power integrity for die, chiplets, interposers, and packaging; chip I/O and power modeling; photonics and wireless integration; PCB, module, and package materials and processing; and memory/HBM, chiplet, multi-die, and 3DIC/SiP interfaces. Other tracks address system co-design and modeling; high-speed links; jitter, noise, and error-ratio measurement and simulation; signal processing, modulation, equalization, and forward error correction; power delivery; EMC/EMI; test and measurement; and interconnect modeling and optimization. The machine-learning and AI track includes electronics design automation, behavioral models, system analytics, and performance optimization. Advanced automotive electronics topics include EV and autonomous systems, sensing, in-vehicle communications, charging, battery technology, and automotive testing. The conference format includes technical sessions, panels, tutorials, and boot camps.

The technical program covers mechanical behavior, reliability, failure analysis, and performance of advanced ceramics and composites; structural, environmental, and functional ceramic coatings; solid oxide cells; thermoelectric and thermionic energy conversion and thermal management; bioceramics; rechargeable energy storage; functional nanomaterials and thin films; advanced processing and manufacturing; porous ceramics; computational and data-driven materials design; production technologies; layered carbides, nitrides, and borides; nuclear fission and fusion materials; crystalline materials; additive manufacturing and 3D printing; geopolymers and sustainable construction materials; photonics and energy; ultrahigh-temperature ceramics; and molecular-level processing of functional materials. Focused themes include bioinspiration and green manufacturing; ceramic materials and integrated approaches for industrial decarbonization; smart powder processing of multifunctional ceramics and catalyst materials; ceramic/carbon-reinforced polymers; sustainable design and manufacturing of advanced ceramics for space applications; and critical-materials recovery and reuse. The program also includes a sustainability forum and a focused session on entrepreneurship and commercialization. The expo and poster program features ceramic and glass industry products, materials, processing and characterization tools, and scientific posters.

Four plenary sessions and technical panels address solid-state transformer (SST) topologies and system architectures; power devices, including SiC, GaN, high-voltage IGBTs, and medium-voltage protection; high-frequency magnetics, packaging, and thermal management; fusion as a potential power source for data centers; SST control, protection, reliability, cybersecurity, and grid services; and grid-interactive data centers, energy storage, onsite generation, and flexible AI loads. The program also includes poster sessions and awards. Panel topics include grid interconnection, microgrids, demand response, renewable integration, battery and long-duration storage, workload flexibility, waste-heat recovery, and coordination between data centers and utilities. Plenary speakers include Dr. Patrick Chapman, Vice President of Enphase Energy and a National Academy of Engineering member, and Dr. Le Xie, Gordon McKay Professor at Harvard University.

The symposium covers power electronics in aerospace and naval systems, grid applications, industrial automation, renewable energy integration, power semiconductor devices, hardware-in-the-loop systems, electric drives, and simulations. The event also includes industry tutorials, industry demonstrations, and technical panels. Its focus spans power electronics technology and innovation from materials to systems, bringing together industry, academic, and government participants. Co-sponsored by UConn CONPEX and the IEEE PELS/PES Joint Student Chapter.

The meeting spans materials science research in quantum materials, energy and sustainability, semiconductors, nanomaterials, soft materials and biomaterials, and structural and functional materials. Symposia address sustainable materials chemistry and processing for lithium and earth-abundant batteries; sodium-ion storage; materials, characterization and manufacturing for solid-state batteries; next-generation EV battery materials; hydrogen storage and transmission; and electrochemical conversion of CO₂ and nitrogen compounds into sustainable products. Other topics include AI-driven materials design and autonomous science, chiplet architectures, 2D materials for microelectronics and neuromorphic computing, additive manufacturing across length scales, high-entropy materials, and resilient materials for fission and fusion reactors. Featured programming includes a plenary on critical elements from urban mines and decarbonization of the metal sectors, a keynote on progress and challenges toward an inertial fusion energy future, and sessions on bioelectronics translation and silicon photonics, optical connectivity, sensing, data centers and commercialization.