Rajiv Mongia

InterPACK is the ASME Electronic and Photonic Packaging Division’s flagship conference, covering electronics packaging, heterogeneous integration, advanced materials, thermal management, computing architectures, and connected devices. Program areas include data-center and server systems; extreme-environment packaging; power and RF electronics and photonics; nanoscale heat transfer and energy storage; flexible, wearable, and printed electronics; intelligent modeling and automation; and micro- and nanoscale mechatronics. Technical subjects include chiplet and wafer-level integration, package reliability, rack cooling, data-center digital twins, thermal interface materials, vibration control, cryogenic and high-temperature systems, wide-bandgap semiconductors, printed-electronics repairability, sustainable inks, and AI and machine learning for simulation and design. Sessions address battery thermal management, AlN semiconductors, nanoscale wetting, liquid cooling for AI infrastructure, and microelectronics for extreme environments. Panels examine thermal and mechanical challenges in mobile, wireless, AI, IoT, automotive, and high-power computing devices; liquid cooling from chip to cooling tower; two-phase electronics cooling; mechanical design for electronics; packaging reliability; and AI-enabled thermal engineering. The program also includes technical presentations, tutorials, exhibits, and poster presentations.

The conference covers research, development, manufacturing, and applications in electronics packaging and heterogeneous integration, with technical paper presentations, panels, workshops, tutorials, keynote and technology talks, exhibits, and a joint poster session. Tracks address heterogeneous integration and multi-die assembly; data-center, modular-edge, server, and information-storage systems; electronic packaging for extreme environments; power/RF electronics and photonics; nanoscale and multiscale heat transfer and energy storage; flexible, wearable, and printed electronics; intelligent modeling, simulation, and automation; interactive presentations; and micro/nano mechatronics, microelectronics, and IoT. Topics include thermal management, reliability, advanced cooling, digital twins, AI and machine learning, additive deposition, sustainable inks, wide-bandgap semiconductors, phase-change heat transfer, extreme-environment materials, and energy systems. Plenary topics include hierarchical battery thermal management and modeling; AlN semiconductors; nanoscale wetting; data-center thermal management for AI; agentic AI cooling; and microelectronics for extreme environments. Panels address thermal and mechanical challenges in mobile, wireless, AI, IoT, automotive, and high-power-computing devices; liquid cooling from chip to cooling tower; two-phase cooling; mechanical design for electronics; packaging and data-center cooling reliability; and AI, simulation, and thermal engineering. Special sessions include next-generation AI data-center infrastructure, government, and reduced-order models.