The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

The published 2027 track framework covers electronic design across chip, board, package, and system levels. Topics include signal and power integrity for die, chiplets, interposers, and packaging; chip I/O and power modeling; photonics and wireless integration; PCB, module, and package materials and processing; and memory/HBM, chiplet, multi-die, and 3DIC/SiP interfaces. Other tracks address system co-design and modeling; high-speed links; jitter, noise, and error-ratio measurement and simulation; signal processing, modulation, equalization, and forward error correction; power delivery; EMC/EMI; test and measurement; and interconnect modeling and optimization. The machine-learning and AI track includes electronics design automation, behavioral models, system analytics, and performance optimization. Advanced automotive electronics topics include EV and autonomous systems, sensing, in-vehicle communications, charging, battery technology, and automotive testing. The conference format includes technical sessions, panels, tutorials, and boot camps.

SPCC combines technical sessions, poster presentations, and business-focused programming on surface preparation, cleaning technologies, and wet processes for semiconductor manufacturing. Technical topics include front-end, back-end, and packaging; cleaning equipment, materials, and metrology; advanced-memory challenges such as pattern collapse, contaminant removal from high-aspect-ratio structures, selective etching, and surface preparation for DRAM, 3D-NAND, and emerging memories; and wet and dry cleaning for FinFET, gate-all-around, nanosheet, nanowire, and CFET devices. Other areas include post-etch and post-CMP cleaning, advanced interconnect and EUV mask cleaning, contamination control, high-purity water and chemical delivery, in-situ monitoring, process control and AI/machine learning, trace-particle and metal detection, and sustainability. The scope also includes surface preparation for Ge, III-V, GaN, SiC, and 2D systems, as well as photovoltaics, MEMS, and nanoelectronics. Business-focused programming addresses macroeconomic, market, and structural trends shaping the global semiconductor industry, including industry dynamics, supply chain, and strategic outlook.

Four plenary sessions and technical panels address solid-state transformer (SST) topologies and system architectures; power devices, including SiC, GaN, high-voltage IGBTs, and medium-voltage protection; high-frequency magnetics, packaging, and thermal management; fusion as a potential power source for data centers; SST control, protection, reliability, cybersecurity, and grid services; and grid-interactive data centers, energy storage, onsite generation, and flexible AI loads. The program also includes poster sessions and awards. Panel topics include grid interconnection, microgrids, demand response, renewable integration, battery and long-duration storage, workload flexibility, waste-heat recovery, and coordination between data centers and utilities. Plenary speakers include Dr. Patrick Chapman, Vice President of Enphase Energy and a National Academy of Engineering member, and Dr. Le Xie, Gordon McKay Professor at Harvard University.

The conference focuses on innovative technologies, research and design advances, and solutions for renewable and sustainable energy, including utility-level systems integration. Selected papers may be considered for publication in an ASME journal. Tracks cover AI for energy systems; heat pump, refrigeration and cryogenic technology; sustainable and resilient buildings; energy storage; hybrid systems and microgrids; solar optics, thermal applications, chemistry and fuels; photovoltaic and electrochemical technologies, including batteries and fuel cells; waste heat recovery, thermal desalination and water harvesting; alternative energy conversion, including geothermal, nuclear, wind, hydro, ocean and wave energy; hydrogen, bioenergy, biofuels and sustainable fuels; combustion, cogeneration and carbon capture, storage and utilization; advanced energy materials and manufacturing; space energy systems and in situ resource utilization; critical mineral recovery and supply chains; data center energy-water and cooling; and sustainability, safety, durability and recyclability of electrochemical storage. The program also includes lightning talks and poster presentations.

The technical program covers mechanical behavior, reliability, failure analysis, and performance of advanced ceramics and composites; structural, environmental, and functional ceramic coatings; solid oxide cells; thermoelectric and thermionic energy conversion and thermal management; bioceramics; rechargeable energy storage; functional nanomaterials and thin films; advanced processing and manufacturing; porous ceramics; computational and data-driven materials design; production technologies; layered carbides, nitrides, and borides; nuclear fission and fusion materials; crystalline materials; additive manufacturing and 3D printing; geopolymers and sustainable construction materials; photonics and energy; ultrahigh-temperature ceramics; and molecular-level processing of functional materials. Focused themes include bioinspiration and green manufacturing; ceramic materials and integrated approaches for industrial decarbonization; smart powder processing of multifunctional ceramics and catalyst materials; ceramic/carbon-reinforced polymers; sustainable design and manufacturing of advanced ceramics for space applications; and critical-materials recovery and reuse. The program also includes a sustainability forum and a focused session on entrepreneurship and commercialization. The expo and poster program features ceramic and glass industry products, materials, processing and characterization tools, and scientific posters.

A multidisciplinary materials research program covering electronics, optics and photonics; energy and sustainability; manufacturing; materials theory, computation and data science; nanomaterials; quantum materials, heterostructures and devices; soft materials and biomaterials; and structural and functional materials. Critical-minerals topics include advanced characterization, AI/ML and materials for enhanced critical minerals recovery and separation, and materials innovation for ultra-pure critical minerals from fundamental science to industrial scaling. Energy symposia address data-driven processing for scalable energy-storage materials manufacturing, earth-abundant active materials for Li-ion batteries, lithium-based battery characterization and computation, critical-material-free chemistries beyond Li-ion, solid-state battery interfaces and processing, solar-energy materials, space photovoltaics, and advanced nuclear fuel and cladding. Manufacturing topics include multiscale additive manufacturing, from nano-architected materials to macroscale structures; sustainable electronics; and processing and manufacturing pathways for emerging electrochemical energy storage. Other subjects include in situ and operando electron and X-ray microscopy, 4D-STEM and AI-enabled imaging; AI-ready materials research platforms; quantum sensing and superconducting materials; soft electronics, biohybrid materials and biosensing.

The program brings together the RF Integrated Circuits (RFIC), RF Systems & Applications (RFSA), and RF Technology & Techniques (RFTT) symposia, followed by the ARFTG Microwave Measurement Conference. The week also includes technical sessions, workshops, panels, plenary sessions, interactive forums, an exhibition, an Executive Forum, and a co-located IEEE Hard Tech Venture Summit. RFIC covers RF through THz integrated circuits and systems, including power amplifiers, front-end modules, oscillators, high-speed interconnects, advanced packaging, and applications such as wireless, radar, satellite communications, sensing, quantum systems, and AI-assisted design. RFSA addresses system-level research and applications including communications, radar, biomedical systems, phased arrays, non-terrestrial communications, and integrated sensing and communications. RFTT covers passive components, filters, packaging and 3D manufacturing, semiconductor technologies, circuit and system CAD, computational electromagnetics, quantum circuits, and sub-THz/THz circuits.