Intel Corporation

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

The conference examines market and technology trends in bulk, rare, and specialty gases used in electronics, for executives, buyers, product managers, and strategic planners across the electronic-gases value chain. Sessions address U.S. semiconductor public policy, CHIPS metrology, gas-system challenges as Moore’s Law advances, vapor-phase materials, large-grain molybdenum deposition, solid precursor delivery, and tungsten powder supply-chain issues. A low-GWP adoption session discusses fab direct emissions, coordinated gas substitution, and industry-wide collaboration. Other technical topics include contamination control and yield, hydrogen-halide contamination, deuterium supply and purity, isotropic dry-cleaning technology, zero-nuclear-spin isotopes for semiconductor fabs and quantum computing, and new etch gases. The program also covers gas-delivery sealing, contamination and reliability tradeoffs; AI applications in automated gas handling; EUV tool gas purification; High NA EUV lithography infrastructure; sub-fab roadmaps and collaboration; precursor delivery and control; abatement; and emissions monitoring. Metrology sessions address MoCl5 stability and impurity measurements in electronic-grade rare gases and ultra-high-purity gases. Market sessions examine the global economy and semiconductors, fab capacity and equipment, helium, and specialty gases.