Pre-SEMICON West Global Chamber® Semiconductor Opportunities Special Event PHX

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

The program combines manufacturing exhibits with an executive perspectives keynote panel series and featured presentations across manufacturing disciplines. Exhibit and technology areas include automation, robotics, smart manufacturing, precision machining, additive manufacturing, software, industrial IoT, advanced materials, cybersecurity, and energy and environmental efficiency. The Smart Manufacturing Experience Knowledge Bars focus on advanced manufacturing technologies and how technology, innovation, and AI can help small and medium-sized manufacturers address technology adoption challenges. The event also features SME Mission Critical: Workforce 2030, focused on manufacturers’ workforce challenges, and the Bright Minds College Experience, with panels, roundtables, executive insights, peer learning, and hands-on exploration of manufacturing technologies.

SPCC combines technical sessions, poster presentations, and business-focused programming on surface preparation, cleaning technologies, and wet processes for semiconductor manufacturing. Technical topics include front-end, back-end, and packaging; cleaning equipment, materials, and metrology; advanced-memory challenges such as pattern collapse, contaminant removal from high-aspect-ratio structures, selective etching, and surface preparation for DRAM, 3D-NAND, and emerging memories; and wet and dry cleaning for FinFET, gate-all-around, nanosheet, nanowire, and CFET devices. Other areas include post-etch and post-CMP cleaning, advanced interconnect and EUV mask cleaning, contamination control, high-purity water and chemical delivery, in-situ monitoring, process control and AI/machine learning, trace-particle and metal detection, and sustainability. The scope also includes surface preparation for Ge, III-V, GaN, SiC, and 2D systems, as well as photovoltaics, MEMS, and nanoelectronics. Business-focused programming addresses macroeconomic, market, and structural trends shaping the global semiconductor industry, including industry dynamics, supply chain, and strategic outlook.

The conference examines market and technology trends in bulk, rare, and specialty gases used in electronics, for executives, buyers, product managers, and strategic planners across the electronic-gases value chain. Sessions address U.S. semiconductor public policy, CHIPS metrology, gas-system challenges as Moore’s Law advances, vapor-phase materials, large-grain molybdenum deposition, solid precursor delivery, and tungsten powder supply-chain issues. A low-GWP adoption session discusses fab direct emissions, coordinated gas substitution, and industry-wide collaboration. Other technical topics include contamination control and yield, hydrogen-halide contamination, deuterium supply and purity, isotropic dry-cleaning technology, zero-nuclear-spin isotopes for semiconductor fabs and quantum computing, and new etch gases. The program also covers gas-delivery sealing, contamination and reliability tradeoffs; AI applications in automated gas handling; EUV tool gas purification; High NA EUV lithography infrastructure; sub-fab roadmaps and collaboration; precursor delivery and control; abatement; and emissions monitoring. Metrology sessions address MoCl5 stability and impurity measurements in electronic-grade rare gases and ultra-high-purity gases. Market sessions examine the global economy and semiconductors, fab capacity and equipment, helium, and specialty gases.

The event features exhibits in automation, robotics, smart manufacturing, precision machining, software solutions, industrial IoT, and cybersecurity. Its Executive Perspectives series is a thought-leadership panel program featuring manufacturing-company executives and technology providers; featured presentations cover diverse manufacturing disciplines. The Smart Manufacturing Experience includes exhibits on smart manufacturing and cybersecurity, plus Knowledge Bar conversations about advanced manufacturing technology, innovation, AI, and technology-adoption challenges for small and medium-sized manufacturers. SME Mission Critical: Workforce 2030 focuses on manufacturers’ workforce challenges.

The conference serves semiconductor-industry executives, engineering and fab managers, academics, startup founders, financial analysts, market researchers, consulting firms, and consortia. Its stated focus is materials innovation, management, and business success; the 2027 agenda is not yet published.

The event features exhibits in automation, robotics, smart manufacturing, precision machining, software, industrial IoT, and cybersecurity, alongside an executive keynote panel series and presentations, technology demonstrations, and interactive Knowledge Bars. The Knowledge Bars address how technology, innovation, and AI can help small and medium-sized manufacturers adopt technology. Featured technology areas also include additive manufacturing, advanced materials, digital transformation, energy and environmental efficiency, and manufacturing engineering. SME Mission Critical: Workforce 2030 focuses on manufacturers’ workforce challenges.

Exhibit areas include automation, robotics, smart manufacturing, precision machining, software solutions, industrial IoT, and cybersecurity. The Executive Perspectives series features panels with manufacturing-company executives and technology providers; Knowledge Bars cover advanced manufacturing technologies and how innovation and AI adoption can address technology challenges for small and midsize manufacturers. Other listed features include the SME Mission Critical: Workforce 2030 experience on manufacturers’ workforce challenges; a Pop Up Factory demonstrating an assembly and inspection workflow that captures data and connects apps, devices, and analytics; and a Corporate and Institutional Roundtable addressing the manufacturing skills gap, alignment between academic outcomes and workforce needs, and strategies for manufacturing’s future. The Bright Minds College Experience includes executive chats, student-led sessions, hands-on exposure to advanced manufacturing technologies, industry roundtables, and discussions about the manufacturing workforce.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.