Arizona Photonics Days 2027

The event covers laser processes for manufacturers, job shops, and suppliers, including laser cutting, welding, 3D printing, and lightweighting applications in automotive, aerospace, and agricultural sectors. The program includes expert presentations, demonstrations, and open houses, with exhibits showcasing laser technologies and applications.

The summit presents an integrated, three-track program connecting aviation, advanced air mobility, space, and defense through shared priorities in supply chains, testbeds, capital, and workforce. Tracks are Flightline (Advanced Air Mobility & Aviation), Orbitline (Space & Space-Enabled Services), and Frontline (Defense, Dual-Use & Manufacturing). Sessions address Arizona entry points into U.S. and allied aerospace ecosystems; corridors, ranges, manufacturing capacity, and emerging spaceports for pilots and multi-domain experiments; intersections of aerospace with microelectronics, biosciences, AI, and advanced manufacturing; and converting strategy into pilots, partnerships, commitments, mission briefs, and Global Aerospace Commitments for 2030.

The technical symposia span ceramic and glass science, engineering, processing, and applications. Topics include ceramic interfaces and grain boundaries; oxide quantum materials; superconductivity, magnetism, and correlated phases; functional ceramics; extreme-environment and microelectronics materials; two-dimensional materials; high-entropy materials; bioceramics; glass surfaces and the glassy state; and computational modeling, data science, and AI/ML for materials discovery and manufacturing. Energy-related subjects include materials for energy storage and conversion, nuclear energy applications, protonic ceramic cells, and materials for a sustainable and resilient energy future. Manufacturing topics include advanced ceramic processing, additive manufacturing, glass manufacturing scale-up, and intelligent manufacturing. The additive-manufacturing symposium covers feedstock design, printing and post-processing, modeling, characterization, process-structure-property relationships, qualification, certification, scale-up, cost, reliability, and industrial implementation. The raw-materials symposium addresses material quality and variability, alternative and recycled feedstocks, sustainable sourcing, circularity, supply-chain resilience, resource security, and decarbonization.

The technical program covers mechanical behavior, reliability, failure analysis, and performance of advanced ceramics and composites; structural, environmental, and functional ceramic coatings; solid oxide cells; thermoelectric and thermionic energy conversion and thermal management; bioceramics; rechargeable energy storage; functional nanomaterials and thin films; advanced processing and manufacturing; porous ceramics; computational and data-driven materials design; production technologies; layered carbides, nitrides, and borides; nuclear fission and fusion materials; crystalline materials; additive manufacturing and 3D printing; geopolymers and sustainable construction materials; photonics and energy; ultrahigh-temperature ceramics; and molecular-level processing of functional materials. Focused themes include bioinspiration and green manufacturing; ceramic materials and integrated approaches for industrial decarbonization; smart powder processing of multifunctional ceramics and catalyst materials; ceramic/carbon-reinforced polymers; sustainable design and manufacturing of advanced ceramics for space applications; and critical-materials recovery and reuse. The program also includes a sustainability forum and a focused session on entrepreneurship and commercialization. The expo and poster program features ceramic and glass industry products, materials, processing and characterization tools, and scientific posters.

An international technical conference on solutions for improving semiconductor manufacturing. Technical presentations highlight industry innovations with specific results, and papers presented at the conference are peer-reviewed by the ASMC Technical Committee; select manuscripts are published in the IEEE Transactions on Semiconductor Manufacturing special section. The 2027 call for abstracts covers Advanced Equipment Processes and Materials; Advanced Metrology; Advanced Process Control; Defect Free Manufacturing; Defect Inspection and Reduction; Big Data Management and Cybersecurity; Equipment Optimization; Manufacturing for Sustainability; Novel Device Technologies; Patterning, Design & Technology Optimization; and Smart Manufacturing & Factory Operations.

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

A multidisciplinary materials research program covering electronics, optics and photonics; energy and sustainability; manufacturing; materials theory, computation and data science; nanomaterials; quantum materials, heterostructures and devices; soft materials and biomaterials; and structural and functional materials. Critical-minerals topics include advanced characterization, AI/ML and materials for enhanced critical minerals recovery and separation, and materials innovation for ultra-pure critical minerals from fundamental science to industrial scaling. Energy symposia address data-driven processing for scalable energy-storage materials manufacturing, earth-abundant active materials for Li-ion batteries, lithium-based battery characterization and computation, critical-material-free chemistries beyond Li-ion, solid-state battery interfaces and processing, solar-energy materials, space photovoltaics, and advanced nuclear fuel and cladding. Manufacturing topics include multiscale additive manufacturing, from nano-architected materials to macroscale structures; sustainable electronics; and processing and manufacturing pathways for emerging electrochemical energy storage. Other subjects include in situ and operando electron and X-ray microscopy, 4D-STEM and AI-enabled imaging; AI-ready materials research platforms; quantum sensing and superconducting materials; soft electronics, biohybrid materials and biosensing.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

Trade show and conference covering automation across manufacturing, logistics, healthcare, energy, and other industries. The conference combines show-floor technology exploration with expert-led sessions; its 2027 programming and speakers are still in development. Show-floor programming includes Keynote Stage presentations, Show Theater sessions and panels on emerging technologies, practical applications, and market trends, and Innovation Stage presentations featuring new hardware, software, technologies, and approaches to work. Other featured programming includes startup pitches, live demos, the Startup Challenge, Innovation Awards, Humanoid Pavilion & Stage, and AMR technology demos.