FOA General Meeting and Networking Lunch

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The morning program includes an overview of Weber Metals, updates on FIA and FIERF initiatives, and presentations on Boeing’s current market outlook and forging supply-chain insights. Attendees will discuss developments affecting the forging industry and its customers. After lunch, tours of Weber Metals and Aluminum Precision Products will cover their manufacturing operations and capabilities.

The program includes keynotes, panels, breakouts, and interactive roundtables on steel-industry conditions; fabrication businesses, leadership, and industry outlook; AI and digitization in manufacturing; shop-floor equipment use cases and return on investment; and manufacturing’s economic and financial outlook. Sessions also address profitability, capital investment, business growth, tariffs, steel, leadership development, recruitment, small- and midsize-manufacturer growth, and potential changes to tax policy, OSHA and EPA regulations, and tariffs. Roundtable topics include culture, marketing, AI, and operations.

The program pairs morning plenary sessions with concurrent Technology and Education & Workforce Development tracks. Topics include AI in manufacturing, manufacturers’ problems and needs, building ARM Institute-funded project teams, funding opportunities, and enrollment in manufacturing training programs. Interactive activities cover moving ARM-funded projects from development to factory-floor deployment; communicating technology needs, risks, and value in proposals; developing education and workforce grant proposals; and creating immersive learning experiences for manufacturing careers. Other program elements include project updates, five-minute member pitches on organizational capabilities, problems seeking collaborators, and products or services, and an introduction to the revamped ARM Member Community. Attendance is limited to ARM Institute members.

The workshop covers advancements, challenges, and gaps in flexible hybrid electronics, hybrid electronics, and bio-signal sensing for real-time cognitive and physical state monitoring and augmentation, and includes AI for Metrology (AI4MT) sessions. Day 1, the Innovation Forum, features technical presentations on advances from FlexTech and NBMC. Day 2, Technical Gap Analysis, uses collaborative breakout sessions to examine technology gaps and roadmaps, shape FlexTech and NBMC research priorities, and inform future Request for Proposal directions. Day 3, the AI for Metrology Workshop, explores connecting metrology, failure-analysis, and test data across the semiconductor supply chain. Topics include AI-assisted defect localization and root-cause analysis, non-destructive modalities, targeted physical characterization, chiplets, heterogeneous integration, and advanced packaging. Industry tours at SkyWater Technology and NeoCity Academy are also listed.

The program includes technical programming, tutorial programming, the Opening Session and EDFAS General Meeting, IPFA and ESREF Best Paper Presentations, the Women in Electronics Failure Analysis session, International Roadmap for Failure Analysis programming, and user-group discussions covering integrated PFA, OFI and system-in-package analysis, sample preparation, FIB, AI, and nanoprobing/SPM. Additional programming includes a peer exchange on funding failure-analysis laboratories and a panel on design for analysis, backside power, heterogeneous integration, and co-packaged optics in the AI era.

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

An international technical conference on solutions for improving semiconductor manufacturing. Technical presentations highlight industry innovations with specific results, and papers presented at the conference are peer-reviewed by the ASMC Technical Committee; select manuscripts are published in the IEEE Transactions on Semiconductor Manufacturing special section. The 2027 call for abstracts covers Advanced Equipment Processes and Materials; Advanced Metrology; Advanced Process Control; Defect Free Manufacturing; Defect Inspection and Reduction; Big Data Management and Cybersecurity; Equipment Optimization; Manufacturing for Sustainability; Novel Device Technologies; Patterning, Design & Technology Optimization; and Smart Manufacturing & Factory Operations.