ITPC 2026—International Trade Partners Conference

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

SPCC combines technical sessions, poster presentations, and business-focused programming on surface preparation, cleaning technologies, and wet processes for semiconductor manufacturing. Technical topics include front-end, back-end, and packaging; cleaning equipment, materials, and metrology; advanced-memory challenges such as pattern collapse, contaminant removal from high-aspect-ratio structures, selective etching, and surface preparation for DRAM, 3D-NAND, and emerging memories; and wet and dry cleaning for FinFET, gate-all-around, nanosheet, nanowire, and CFET devices. Other areas include post-etch and post-CMP cleaning, advanced interconnect and EUV mask cleaning, contamination control, high-purity water and chemical delivery, in-situ monitoring, process control and AI/machine learning, trace-particle and metal detection, and sustainability. The scope also includes surface preparation for Ge, III-V, GaN, SiC, and 2D systems, as well as photovoltaics, MEMS, and nanoelectronics. Business-focused programming addresses macroeconomic, market, and structural trends shaping the global semiconductor industry, including industry dynamics, supply chain, and strategic outlook.

The conference serves semiconductor-industry executives, engineering and fab managers, academics, startup founders, financial analysts, market researchers, consulting firms, and consortia. Its stated focus is materials innovation, management, and business success; the 2027 agenda is not yet published.

An international technical conference on solutions for improving semiconductor manufacturing. Technical presentations highlight industry innovations with specific results, and papers presented at the conference are peer-reviewed by the ASMC Technical Committee; select manuscripts are published in the IEEE Transactions on Semiconductor Manufacturing special section. The 2027 call for abstracts covers Advanced Equipment Processes and Materials; Advanced Metrology; Advanced Process Control; Defect Free Manufacturing; Defect Inspection and Reduction; Big Data Management and Cybersecurity; Equipment Optimization; Manufacturing for Sustainability; Novel Device Technologies; Patterning, Design & Technology Optimization; and Smart Manufacturing & Factory Operations.

The conference examines U.S. competition with China across advanced industries and the policy changes ITIF says are needed to protect U.S. technological leadership, economic strength, and national security. Sessions address China’s industrial and geopolitical position; emerging techno-industrial challenges in biopharmaceuticals, commercial aviation, and robotics; and obstacles to long-term investment in strategic industries. Other discussions consider political momentum for a comprehensive response, structural changes to federal science and innovation funding, strategic trade partnerships involving joint R&D and coordinated export and import controls, the War Department’s role in economic statecraft, and lessons from the post-1948 national security establishment.

The technical program combines peer-reviewed lecture and poster presentations, industry presentations, professional education seminars, plenary programming, and expert debates. Seminar themes include wide-bandgap device reliability, AI in power electronics, magnetics, converter topologies, electromagnetic compatibility and motor drives, and data-center power delivery. Specific topics include SiC and GaN switching behavior, online condition monitoring, AI-assisted converter design, planar magnetics, solid-state transformers, electric drives and e-mobility, and power delivery for AI accelerators and data centers. Technical and industry programming addresses modeling and simulation, data-center power systems, inverter design, chargers, power devices, test and characterization, and integrated voltage regulators. Debate topics include integrated voltage regulator roadmaps and roadblocks, whether solid-state transformers are ready for deployment, and whether future power-electronics breakthroughs will come from academia or industry. APEC is sponsored by the Power Sources Manufacturers Association, IEEE Power Electronics Society, and IEEE Industry Applications Society.

The program includes company presentations, a concierge discussion and feedback, economic development perspectives, and Q&A. It is intended for semiconductor supply-chain leaders, companies seeking advanced-manufacturing business, economic development leaders, and service providers. The event also welcomes companies from multiple regions, including Malaysia, the Republic of Korea, the United States, Mexico, Canada, Taiwan, Japan, Thailand, Vietnam, the Philippines, Germany, the Netherlands, the United Kingdom, Israel, Yemen, and the UAE. A concierge approach is designed to help companies entering the U.S. semiconductor supply chain connect with relevant people. The event also highlights opportunities to connect with Malaysian exhibitors.