SEMICON West 2026

The program includes company presentations, a concierge discussion and feedback, economic development perspectives, and Q&A. It is intended for semiconductor supply-chain leaders, companies seeking advanced-manufacturing business, economic development leaders, and service providers. The event also welcomes companies from multiple regions, including Malaysia, the Republic of Korea, the United States, Mexico, Canada, Taiwan, Japan, Thailand, Vietnam, the Philippines, Germany, the Netherlands, the United Kingdom, Israel, Yemen, and the UAE. A concierge approach is designed to help companies entering the U.S. semiconductor supply chain connect with relevant people. The event also highlights opportunities to connect with Malaysian exhibitors.

The conference theme is “Beyond the $1T Milestone: Building the Next Chapter of Semiconductor Growth.” Topics include semiconductor demand, AI, memory, advanced packaging, quantum technologies, manufacturing capacity, supply chain resilience, and ecosystem partnerships. Program sessions address macroeconomic outlook and geopolitics; memory and AI semiconductor demand; non-AI semiconductor, equipment, and materials forecasts; advanced packaging; quantum computing; robotics; co-packaged optics; and inference AI. Further sessions examine global fab capacity, whether semiconductor capacity can keep pace with demand, and what it will take to sustain the next era of growth. A Bulls & Bears panel focuses on U.S. semiconductor and semiconductor capital-equipment investment.

An international technical conference on solutions for improving semiconductor manufacturing. Technical presentations highlight industry innovations with specific results, and papers presented at the conference are peer-reviewed by the ASMC Technical Committee; select manuscripts are published in the IEEE Transactions on Semiconductor Manufacturing special section. The 2027 call for abstracts covers Advanced Equipment Processes and Materials; Advanced Metrology; Advanced Process Control; Defect Free Manufacturing; Defect Inspection and Reduction; Big Data Management and Cybersecurity; Equipment Optimization; Manufacturing for Sustainability; Novel Device Technologies; Patterning, Design & Technology Optimization; and Smart Manufacturing & Factory Operations.

The technical program covers semiconductor and electronic-device technology, design, manufacturing, physics, and modeling, including CMOS transistor technology, advanced memory, displays, sensors, MEMS, quantum and nanoscale devices, optoelectronics, power and energy-harvesting devices, and emerging material systems. Featured technical themes include AI-driven semiconductor scaling and system integration; memory technologies and system co-optimization; IDM manufacturing trends; chiplets, heterogeneous integration, and 3D stacking; AI and machine learning in physics-based semiconductor modeling; advanced-packaging reliability; cryogenic electronics for quantum computing; and optical devices for co-packaged optics and optical I/O. Short-course subjects include AI-era logic scaling, atomic-layer processing, HBM, NAND, spintronics, and memory-centric computing.

The event features exhibits in automation, robotics, smart manufacturing, precision machining, software, industrial IoT, and cybersecurity, alongside an executive keynote panel series and presentations, technology demonstrations, and interactive Knowledge Bars. The Knowledge Bars address how technology, innovation, and AI can help small and medium-sized manufacturers adopt technology. Featured technology areas also include additive manufacturing, advanced materials, digital transformation, energy and environmental efficiency, and manufacturing engineering. SME Mission Critical: Workforce 2030 focuses on manufacturers’ workforce challenges.

The conference serves semiconductor-industry executives, engineering and fab managers, academics, startup founders, financial analysts, market researchers, consulting firms, and consortia. Its stated focus is materials innovation, management, and business success; the 2027 agenda is not yet published.

The program combines manufacturing exhibits with an executive perspectives keynote panel series and featured presentations across manufacturing disciplines. Exhibit and technology areas include automation, robotics, smart manufacturing, precision machining, additive manufacturing, software, industrial IoT, advanced materials, cybersecurity, and energy and environmental efficiency. The Smart Manufacturing Experience Knowledge Bars focus on advanced manufacturing technologies and how technology, innovation, and AI can help small and medium-sized manufacturers address technology adoption challenges. The event also features SME Mission Critical: Workforce 2030, focused on manufacturers’ workforce challenges, and the Bright Minds College Experience, with panels, roundtables, executive insights, peer learning, and hands-on exploration of manufacturing technologies.

The program centers on “Trusted Sustainable Silicon Intelligence from Edge to Cloud,” with plenary papers and parallel technical presentations. Technical areas include analog circuits, data converters, digital circuits and architectures, image sensors and displays, medical circuits, memory, power management, RF and wireless systems, security, technology directions, and wireline. Tutorial topics include circuit design for autonomous vehicles, switched-capacitor power converters, adaptive clocking, time-domain ADCs, machine-learning accelerators, energy-harvesting sensors, mm-wave local-oscillator techniques, analog design automation, radar and sensing, and die-to-die interfaces. Six Advanced-Circuit-Design Forums address AI and HPC co-design; high-speed wireline data converters; electrical and optical connectivity; AI-optimized sensing; circuits for 6G communication, sensing, and edge AI; and silicon systems for quantum sensing and computing. Other program elements include “The Analog Renaissance: Can Unconventional Physical Computing and Optical Interconnects Define the Next Strategic Leap?”, a Student Research Preview with work-in-progress presentations and posters, an invited industry track on commercial chips and systems for AI training and inference, and demonstration sessions. The short course covers hardware security, including cryptographic architectures, hardware attacks and chip-level countermeasures, and hardware roots of trust. Plenary speakers include Marco Pieters, Executive Vice President and Chief Technology Officer at ASML, and Matt Murphy, Chairman and CEO of Marvell.

SPCC combines technical sessions, poster presentations, and business-focused programming on surface preparation, cleaning technologies, and wet processes for semiconductor manufacturing. Technical topics include front-end, back-end, and packaging; cleaning equipment, materials, and metrology; advanced-memory challenges such as pattern collapse, contaminant removal from high-aspect-ratio structures, selective etching, and surface preparation for DRAM, 3D-NAND, and emerging memories; and wet and dry cleaning for FinFET, gate-all-around, nanosheet, nanowire, and CFET devices. Other areas include post-etch and post-CMP cleaning, advanced interconnect and EUV mask cleaning, contamination control, high-purity water and chemical delivery, in-situ monitoring, process control and AI/machine learning, trace-particle and metal detection, and sustainability. The scope also includes surface preparation for Ge, III-V, GaN, SiC, and 2D systems, as well as photovoltaics, MEMS, and nanoelectronics. Business-focused programming addresses macroeconomic, market, and structural trends shaping the global semiconductor industry, including industry dynamics, supply chain, and strategic outlook.