The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems
Date
October 26
Organization
Format
In-Person
Location
San Diego, CA
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About
InterPACK is a forum for research, development, manufacturing, and applications in electronics packaging and heterogeneous integration. Coverage includes advanced materials, thermal management, next-generation computing architectures, and intelligent connected devices. Tracks include Heterogeneous Integration; Data Center, Modular Edge Systems, and Information Storage Systems; Electronic Packaging for Extreme Environments; Power/RF Electronics and Photonics; Nanoscale Heat Transfer, Multiscale Thermal Transport and Energy Storage; Flexible, Wearable, and Printed Electronics; Intelligent Modeling, Simulation, and Automation Systems; and Micro/Nano Mechatronics, Microelectronics, Microelectrochemical Systems, and Internet of Things applications. Plenary speakers include Cristina Amon, University Professor, Alumni Distinguished Professor, and Dean Emerita at the University of Toronto; Bahgat Sammakia, Distinguished SUNY Professor and Director at Binghamton University; and Shintaro Itoh, Professor at Nagoya University. Plenary topics include battery thermal management and modeling, thermal management of AI data centers, and wetting phenomena in nanoscale spaces.
Speakers(3)
University Professor, Alumni Distinguished Professor, and Dean Emerita, University of Toronto
Distinguished SUNY Professor and Director, Binghamton University
Professor, Nagoya University
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