InterPACK 2026
Date
October 26
Organization
Format
In-Person
Location
San Diego, CA
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About
InterPACK is the flagship conference of ASME’s Electronic and Photonic Packaging Division and focuses on research, development, manufacturing, and applications in electronics packaging and heterogeneous integration. Program areas include Heterogeneous Integration; Data Center, Modular Edge Systems, and Information Storage Systems; Electronic Packaging for Extreme Environments; Power/RF Electronics and Photonics; Nanoscale Heat Transfer, Multiscale Thermal Transport and Energy Storage; Flexible, Wearable, and Printed Electronics; Intelligent Modeling, Simulation, and Automation Systems; and Micro/Nano Mechatronics, Microelectronics, Microelectrochemical Systems, and Internet of Things applications. The event includes technical paper sessions, exhibits, panel discussions, workshops, tutorials, keynote and technology talks, and a joint poster session. Plenary speakers include Cristina Amon, University Professor, Alumni Distinguished Professor, and Dean Emerita at the University of Toronto; Samuel Graham, Dean of Engineering at the University of Maryland; Bahgat Sammakia, Distinguished SUNY Professor and Director at Binghamton University; and Shintaro Itoh, Professor at Nagoya University. Featured topics include battery thermal management and modeling, AlN semiconductor devices, AI data-center cooling, and nanoscale wetting for advanced manufacturing and thermal-management systems.
Speakers(4)
University Professor, Alumni Distinguished Professor, and Dean Emerita, University of Toronto
Dean of Engineering, University of Maryland
Distinguished SUNY Professor and Director, Binghamton University
Professor, Nagoya University
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